MIPI Alliance

MIPI Alliance
Company typeTrade association
IndustryMobile and mobile-influenced devices
Founded2003
Headquarters
United States
Number of locations
Global
Websitewww.mipi.org

MIPI Alliance is a global business alliance that develops technical specifications for the mobile ecosystem, particularly smart phones but including mobile-influenced industries. MIPI was founded in 2003 by Arm, Intel, Nokia, Samsung, STMicroelectronics and Texas Instruments.[1]

Non-member organizations have limited access to MIPI standards, with some exceptions. The exceptions generally take the form of a public version of the standard. An example of one of these exceptions is the I3C Basic standard which requires no license from MIPI to implement.[2]

The organization comprises about 330 member companies worldwide, 15 active working groups and has delivered more than 45 specifications within the mobile ecosystem in the last decade. MIPI specifications provide interface solutions for mobile handsets. As the traditional mobile ecosystem has expanded to include tablets and laptops, MIPI Alliance's specifications are implemented beyond mobile phones including: tablets, PCs, cameras, industrial electronics, Machine to Machine (IoT), augmented reality, automotive, and medical technologies.[3]

MIPI members include handset manufacturers, device OEMs, software providers, semiconductor companies, application processor developers, IP tool providers, test and test equipment companies, as well as camera, tablet and laptop manufacturers.

  1. ^ Mobile Chip Interface Gets Real Merritt, Rick “EE Times”, US, 13 February 2006.
  2. ^ Group, Ken Foust, Chair of the MIPI I3C Working Group and MIPI I3C Basic Ad Hoc Working. "MIPI Alliance Delivers New I3C Basic Specification". resources.mipi.org. Retrieved 2020-04-06. {{cite web}}: |last= has generic name (help)CS1 maint: multiple names: authors list (link) CS1 maint: numeric names: authors list (link)
  3. ^ Understanding MIPI Alliance Interface Specifications Wietfeldt, Rick and Lefkin, Peter “Electronic Design”, US, 1 April 2014.

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