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Thick-film technology

Thick-film technology is used to produce electronic devices/modules such as surface mount devices modules, hybrid integrated circuits, heating elements, integrated passive devices and sensors. Main manufacturing technique is screen printing (stenciling), which in addition to use in manufacturing electronic devices can also be used for various graphic reproduction targets. It became one of the key manufacturing/miniaturisation techniques of electronic devices/modules during 1950s. Typical film thickness – manufactured with thick film manufacturing processes for electronic devices – is 0.0001 to 0.1 mm.[1]

Thick-film circuits/modules are widely used in the automotive industry, both in sensors, e.g. mixture of fuel/air, pressure sensors, engine and gearbox controls, sensor for releasing airbags, ignitors to airbags; common is that high reliability is required, often extended temperature range also along massive thermocycling of circuits without failure.[2] Other application areas are space electronics, consumer electronics, and various measurement systems where low cost and/or high reliability is needed.

The simplest form to utilise a thick film technology is a module substrate/board, where wiring is manufactured using thick film process. Additionally resistors and large tolerance capacitors can be manufactured with thick film methods. Thick film wiring can be made compatible with surface-mount technology (SMT), and if needed (due to tolerances and/or size requirements) surface-mountable parts (resistors, capacitors, ICs, etc.) can be assembled on a thick film substrate.

The manufacturing of thick film devices/modules is an additive process involving deposition of several (typically max 6–8) successive layers of conductive, resistive and dielectric layers onto an electrically insulating substrate using a screen-printing process.[3]

Thick Film Resistor Networks

As a low cost manufacturing method it is applicable to produce large volumes of discrete passive devices like resistors, thermistors, varistors and integrated passive devices.

Thick film technology is also one of the alternatives to be used in hybrid integrated circuits and competes and complements typically in electronics miniaturization (parts or elements/area or volume) with SMT based on PCB (printed circuit board)/PWB (printed wiring board) and thin film technology.[4]

  1. ^ Kasap, S.; Capper, P., eds. (2017). Springer Handbook of Electronic and Photonic Materials. Springer International Publishing. pp. 707–721. ISBN 978-3-319-48933-9.
  2. ^ Lu, B. (2010). "Thick film hybrid technology for automotive applications". 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference. pp. 1–34. doi:10.1109/IMPACT.2010.5699549. ISBN 978-1-4244-9783-6. S2CID 33904731.
  3. ^ Andrew, W., ed. (1998). Hybrid Microcircuit Technology Handbook (Second ed.). Elsevier Inc. pp. 104–171.
  4. ^ Vandermeulen, M.; Roy, D.; Pirritano, S.; Bernacki, D.; et, al (2004). "High Density Thick Film Substrates for Miniaturized 3D Chip Stacking Packaging Solutions". 37th International Symposium on Microelectronics (IMAPS 2004): Everything in Electronics...Between the Chip and the System. doi:10.13140/RG.2.1.1087.3369.

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